High-Density Interconnect (HDI) PCB Market is expected to reach $19.1 Billion by 2027 – An exclusive market research report by Lucintel
Trends and Forecast for the Global High-Density Interconnect (HDI) PCB Market
Trends, opportunities and forecast in high density interconnect PCB market to 2027 by end use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others), technology (4-6 layer, 8-10 layer, and 10+ layer), build-up layer count (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)
Lucintel’s latest market report analyzed that high-density interconnect (HDI) PCB provides attractive opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries.
